DISCO Corporation | Semiconductor Materials and Equipment
DISCO Corporation. Precision Machines: Dicing Saws, Laser Saws, Grinders, Polishers, Wafer Mounter, Die Separator, Surface Planer, WaterJet Saw. Precision Processing Tools: Dicing Blades, Grinding Wheels, Dry Polishing Wheels. ... Accessory Equipment Related Products Cut-Off Wheels. Products in categories. Diamond Tools. Ingot and Substrate ...
About DISCO | DISCO Corporation
About DISCO. DISCO business details, names of executives, number of employees and other basic information are provided.
Disco Corporation | Production Equipment | Japan
Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 Click to show company phone Japan : Staff Information No. Staff 5,362 Business Details Equipment Types Wafer Production Equipment: Cutting Equipment, Wafer Grinding Equipment, Wafer Polishing Machine Last Update 9 Oct 2022 Update Above Information
DFG8640 | Grinders | Product Information | DISCO Corporation
DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual
Your Nearest DISCO Office | DISCO Corporation
DISCO HI-TEC KOREA Corporation Malaysia DISCO HI-TEC (MALAYSIA) SDN. BHD. Kuala Lumpur Office Map. DISCO HI-TEC (MALAYSIA) SDN. BHD. ... Customer Equipment Improvement Information (CSMDC) Useful Improvement Information (Technical Newsletters) SDS; Inspection Sheet Search;
Accessory Equipment | Product Information | DISCO …
DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently.
Polishing | Solutions | DISCO Corporation
In contrast, DISCO equipment possess a feed axis and places the polishing pad above and the wafer below. This structure is called "in-feed polishing" and is used for both dry polishing and wet polishing (polishing method that utilizes typical CMP chemicals). DISCO's wet polishing, introduced here, realizes scratch reduction, mirror ...
Disco Corporation (6146.T)
Find the latest Disco Corporation (6146.T) stock quote, history, news and other vital information to help you with your stock trading and investing.
Business Calendar | About DISCO | DISCO Corporation
About DISCO. DISCO business details, names of executives, number of employees and other basic information are provided.
Disco Corporation: -Openfos
Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website provides overall corporate information of DISCO such as the variety of products and technical information on the semiconductor manufacturing equipment, investor relations, and recruiting.
Investors | DISCO Corporation
About DISCO. DISCO business details, names of executives, number of employees and other basic information are provided.
Grinding | Solutions | DISCO Corporation
DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions.
DISCO Corporation, The World Leader In Semiconductor …
DISCO holds leading market share in the production of wafer grinders, grinding wheels, wafer dicing saws, laser saws, and surface planarization. These …
DAG810 | Grinders | Product Information | DISCO Corporation
Simple and compact single-axis grinder. The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed …
Disco Corporation (DSCSY)
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. ... and other products, such as accessory equipment, cut-off wheels, and ...
DISCO Corporation Product and technology information
Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.
DCS1440 | Accessory Equipment | Product Information | DISCO Corporation
Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.
TCFD | Environmental Management System | SDGs …
Regarding the raw materials and parts that are used in DISCO's precision processing equipment, precision processing tools (consumables), and functional consumables (chemical products, etc.), DISCO is aware that …
2022 | News | DISCO Corporation
DISCO Corporation (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya), a semiconductor processing equipment manufacturer, was awarded fourth place out of 524 companies in "Best Workplaces 2022" ranking, produced by the Great Place to Work® Institute Japan (GPTW*JAPAN). DISCO has ranked in for this award for 14 …
Dicing and Grinding Using the Conventional Process (TGM – …
In the conventional packaging process of semiconductor manufacturing (TGM, Thin Grinding Mounting), the substrate (wafer) is ground to the designated thickness and …
DTU1550 | Accessory Equipment | Product Information | DISCO Corporation
Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.
Dicing and Grinding Service | Solutions | DISCO Corporation
This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are …
Dicing Thin Wafers | Blade Dicing | Solutions | DISCO Corporation
DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual
Accessory Equipment | Product Information | DISCO Corporation
Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.
DFG8640 | Grinders | Product Information | DISCO Corporation
DFG8640 is a fully automatic grinder equipped with two spindles, three chuck tables, and one turntable. This equipment supports various workpieces up to Φ8 inches, including …
StayClean-F | Related Products | Product Information | DISCO Corporation
DISCO offers training on maintenance and operation of various equipment models to help customers better understand the products and be able to use them more efficiently. Training Center in Japan Course Composition and Training Manual
Grinding Process Using Wheels｜Glass processing｜DISCO …
Thinning and grinding of semiconductor packages. Thinning and grinding of devices that use all types of electronic or optical components. DISCO Corporation provides glass …
2019 | News | DISCO Corporation
DISCO Corporation (Head Office: Ota-ku in Tokyo; President: Kazuma Sekiya), a semiconductor manufacturing equipment manufacturer, has developed "MUSUBI", a cluster system *1 featuring efficient wafer transfer and reduced wafer breakage risk, accomplished by connecting multiple equipment units as necessary for the …
Manual Downloads | Product Information | DISCO Corporation
Product Information. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment.
2023 | News | DISCO Corporation
DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has opened a new mid-process research center on July 1, 2023. ... About DISCO DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including …